High Purity Polished Tungsten Wafer

Model No.: JDTG-TW-001

Brand: ZZJD

Place Of Origin: China

Size: Support customization Length&Diameter

Material: Tungsten

Tungsten alloy wafers are specialized materials used in various high-tech applications, particularly in the semiconductor and electronics industries. Here are some key points about tungsten alloy wafers:

1. Composition: Tungsten alloys typically consist of tungsten combined with other metals like nickel, iron, or copper.

2. Properties:

- High melting point (up to 3422°C)

- Excellent thermal conductivity

- Good electrical conductivity

- High density and strength

- Resistance to corrosion and wear

3. Applications of Tungsten wafer:

- Semiconductor manufacturing equipment

- X-ray targets

- Radiation shielding

- High-temperature furnace components

- Military and aerospace parts

4. Manufacturing process:

- Powder metallurgy techniques

- Sintering at high temperatures

- Precision grinding and polishing to achieve desired thickness and flatness

5. Specifications:

- Typically available in thicknesses ranging from 0.1 mm to several millimeters

- Diameter can vary, but common sizes include 100mm, 150mm, and 200mm

6. Surface finish:

- Can be polished to very smooth finishes (e.g., <10 nm Ra)

7. Customization:

- Can be produced in various shapes and sizes based on specific application requirements

8. Quality control:

- Strict dimensional tolerances and material consistency are maintained

9. Cost:

- Generally more expensive than standard metal wafers due to the specialized nature of tungsten alloys

10. Research and development:

- Ongoing work to improve properties and develop new applications for these materials